IEEE VIC Summit @ The Palace in San Francisco, CA
May 25 all-day


Join us for the 1st annual IEEE Vision, Innovation, and Challenges Summit & Honors Ceremony Gala “IEEE VICS” on 25 May 2017 at the Palace Hotel in San Francisco.

Engineers are at the center of innovation. They have improved our quality of life and changed the way we live, work, communicate, and obtain knowledge. Evolutionary changes would not have been possible without the work of engineering and technology pioneers, whose work inspires others to turn today’s impossibilities into tomorrow’s realities.

IEEE is the trusted source of information from research and standards to conferences and education, and we plan to leverage that trust and curate a new event that demonstrates IEEE’s breadth and reach. We have created a one-day event to showcase the breadth of engineering by bringing together innovators, visionaries, and leaders of technology to discuss what is imminent, to explore what is possible, and what will these emerging areas mean for the future. The 2017 IEEE Vision, Innovation, and Challenges Summit (2017 IEEE VIC Summit) will present a unique opportunity to meet, mingle, and network with peers and some of the top technology “Giants” in the world.

The IEEE VIC Summit and Awards will include dynamic speakers in an interactive setting and culminate with the evening’s festivities that will include the celebration of contributions of some of the world’s most revered innovators, leaders, and legends at the Honors Ceremony. The IEEE Honors Ceremony presents IEEE’s highest-level awards for exceptional achievements and outstanding contributions that have made a lasting impact on technology, society, and the engineering profession.

IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity.

2017 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2017) @ Hawaii Convention Center
Jun 4 – Jun 6 all-day


Submit Your Paper Today!

RFIC2017 Paper Submission

Deadline: 9 January 2017


The premier IEEE conference in the world focused on RFIC technologies invite authors to submit technical papers describing original work and/or advanced practices in the following areas, but not limited to:
  • Millimeter-wave circuits and ICs with focus on 28GHz cellular and 802.11ad/ay WiGig systems
  • Wireless Mobile and Connectivity transceivers for sub-6 GHz 5G, advanced-LTE, and MU-MIMO WiFi
  • Low-power transceivers for IoT and other key new low energy wireless applications
  • RF/Analog front-end and mixed-signal baseband circuits with focus on advancements in full-duplex applications, RF front-end interference cancellation, and high performance ADCs
  • Reconfigurable and tunable front-ends with focus on cognitive radios, advanced connectivity radios, and N-path filter based tunable circuits
  • Power amplifiers and advanced transmitter circuits with focus on high-frequency PAs, higher-class cellular UE PAs,  linearization, and efficiency enhancement
  • RFIC modeling, simulation, testing, process, devices, and packaging technologies

This year in RFIC2017, focus on 5G Technologies:

Jointly with the IMS 5G summit and executive forum held on Monday and Tuesday afternoons (June 5 & 6, 2017), the RFIC2017 Monday morning technical session will be dedicated to original academic and industrial work in future sub-6GHz and 28GHz mobile 5G radios, including 60GHz WiGig connectivity. Consider submitting your paper focused on 5G technologies advancement!


Not to forget that RFIC symposium has a Best Student Paper Award and an Industry Best Paper Award!
RFIC will recognize outstanding technical contributions from academia and industry sources, which will significantly benefit the RFIC community at large. Consider submitting your paper that describes innovation of an integrated circuit or a system application that potentially has the highest impact on RFIC technology and products!



For more information and to submit your paper click on the links below:
View the Call for Papers
Author Instructions


Click Here to Submit Your Paper


In conjunction with IMS Microwave Week, we invite you to come and enjoy



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