IEEE FOOTHILL INVITED TO CLASTECH 2017 MEETING, FRIDAY OCTOBER 20, 2017
| October 1, 2017 | Posted by Frank Gomez under CN, COMSOC, MTT/APS |
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Can you identify this WW II aircraft?
Notice to ALL IEEE Foothill Section Members—
An INVITATION from the IEEE Coastal Los Angeles Section—-
CLASTECH 2017 is coming soon—FRIDAY October 20, 2017—Meeting in LAX area
CLASTECH 2017 means a full day of talks on topics in microwaves (MTT) antennas (APS) , and related areas, including COMSOC.
We’ll be at the newly remodeled Proud Bird- come and check it out! We were last here for the successful CLASTECH 2015. We’ve lined up some great talks on phased arrays, EM simulation and modelling, 3D circuits, THz, EMC, and more.
Here are background notes for some of the CLASTECH 2017 speakers. Consider these notes as previews of their potential talks.
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Prof. Hossein Hashemi, USC
Professor Hashemi’s group at USC emphasizes Radio Frequency, Microwave, and Millimeter-Wave Integrated Circuits and Systems. Some of their recent work involves:
Waveform engineering in a mm-Wave stacked-HBT switching power amplifiers (class K),
An 8-element common-mode-coupled 106 GHz fundamental oscillator with −111 dBc/Hz phase noise at 1 MHz offset,
Tunable Duplexer With Passive Feed-Forward Cancellation to Improve the RX-TX Isolation, and
Tunable Duplexer With Passive Feed-Forward Cancellation to Improve the RX-TX Isolation.
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Prof. Ethan Wang, UCLA
Among the recent reports from Professor Wang’s group at UCLA are:
Active Noise Filtering for X -Band GaN Transmitters With Bitstream Modulations,
Two dimensional (2D) complex permeability characterization of thin film ferromagnetic material,
An X -Band Pulsed Load Modulation Transmitter With Multilevel Envelope Delta–Sigma Modulations,
3D ADI-FDTD modeling of platform reduction with thin film ferromagnetic material, and
Broadband Parametric Circulator with Balanced Monolithic Integrated Distributedly Modulated Capacitors (DMC).
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Prof. Gabriel Rebeiz, University of California San Diego.
Professor Rebeiz’s expertise includes design of silicon RFICs for microwave and millimeter-wave systems with a specialty on phased arrays and low power circuits, active and passive imaging systems up to THz frequencies (including thermal imagers), THz CMOS and SiGe electronics, RF micro-electro-mechanical systems (RF MEMS), reconfigurable front-ends including tunable filters and tunable antennas, cognitive radios, planar antennas from RF to THz frequencies, radars, and collision avoidance systems for automotive applications. He has spoken at a Prior CLASTECH on RF MEMS. Among the current efforts of his group are:
An ultra low-cost 32-element 28 GHz phased-array transceiver with 41 dBm EIRP and 1.0–1.6 Gbps 16-QAM link at 300 meters,
W -Band Direct-Modulation >20-Gb/s Transmit and Receive Building Blocks in 32-nm SOI CMOS,
A 10–40 GHz frequency quadrupler source with switchable bandpass filters and > 30 dBc harmonic rejection,
Bi-directional flip-chip 28 GHz phased-array core-chip in 45nm CMOS SOI for high-efficiency high-linearity 5G systems, and
Bandpass-to-Bandstop Reconfigurable Tunable Filters with Frequency and Bandwidth Controls
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Dr. Nathan Kundtz, from Kymeta.
Kymeta develops Metamaterial surface antenna technology.Some of their current efforts include:
Commercialization through diffractive metamaterials and liquid crystal display manufacturing,
An extremum-seeking controller for dynamic metamaterial antenna operation, and
Sidelobe Canceling for Reconfigurable Holographic Metamaterial Antenna
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Dr. Larry Williams, Ansys.
Will we receive an update on HFSS and finite element / integral equation approach to solve complex EM structures?
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Prof. Mona Jarrahi, UCLA
Professor Jarrabi directs research projects in the Terahertz Electronics Laboratory at UCLA that involve analytical and experimental studies on the use of new materials and device concepts to mitigate performance limitations of existing terahertz and millimeter-wave devices. This team works on the development of novel high-performance terahertz sources, detectors, spectrometers, reconfigurable meta-films, imaging and spectroscopy systems that leverage photonic, plasmonic, and MEMS concepts. Recent technical efforts include:
High-performance terahertz optoelectronics based on plasmonic photoconductors,
Optical-Pump Terahertz-Probe Studies at Nanoscale: Extraordinary Interaction of Terahertz and Optical Waves through Metallic Nano-Slits,
Continuous-Wave Ultraviolet Emission through Fourth-Harmonic Generation in a Whispering-Gallery Resonator, and
Monolithic integration of GaAs/AlGaAs phase modulator and photodetector for RF photonics
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Zhong Chen, from ETS-Lindgren.
This group is involved with EMC Test Site Qualifications, and the standards that are needed for EMC testing of all electronic components and systems.
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David Sherrer , president of Nuvotronics.
David Sherrer is a successful technical business entrepreneur, with specialization in microfabrication and microelectronic systems. Their main product line involves their PolyStrats (Trademark) technology. This resulted from a DARPA 3D_MERFS program, and has lead to successful high volume production.
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Dr. Vesna Radisic, Northrop Grumman
Recent reports from his group at Northrup Grumman include:
W-Band InP HBT Power Amplifiers,
Heterogeneously Integrated W-Band Downconverter (87 to 100 GHz),
W-band InP transmission line metamaterial
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Early registration is only $20, onsite registration will be $40.
@ PROUD BIRD Restaurant / Meeting Center in the LAX area
11022 Aviation Blvd, Los Angeles, CA 90045+1-310-670-3093
Registration site : https://www.eventbrite.com/e/clastech-2017-tickets-36808043850
Check out our web page for the preliminary program – http://www.clastech.org
Contact c.jackson@ieee.org for more information
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