Blog Archives
Silicon-Based Millimeter-Wave Phased Arrays for 5G: Fundamentals to Future Trends
September 14, 2021 | Posted by Osman Ceylan under |
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On September 18th the AP/MTT and ED/CAS Chapters of the IEEE Foothill Section are hosting the Distinguished Microwave Lecture:
Silicon-Based Millimeter-Wave Phased Arrays for 5G: Fundamentals to Future Trends
Presented by Dr. Bodhisatwa Sadhu from IBM T.J. Watson Research Center & Columbia University
5G cellular communications use millimeter-wave phased arrays to achieve high data rates and low latency. The majority of the 5G millimeter-wave infrastructure will be partially or completely based on silicon technology. This talk will discuss key aspects of silicon-based millimeter-wave phased-array module design and characterization. It will cover fundamentals of phased arrays, provide an overview of phased array antenna modules using silicon technology, and take a deep dive into an example 5G phased array antenna module. The talk will end with a peek into the future of 5G directional communications.
Please join us for this fascinating and compelling presentation.
https://events.vtools.ieee.org/m/279289
Architecture and Technology Implications of a Chiplet-Based Future
July 21, 2021 | Posted by Osman Ceylan under |
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On Friday, July 23, 2021 @ 8:00am PDT, the IEEE San Diego APS/CAS/EDS/MTTS/SSCS Joint Chapter is presenting:
Architecture and Technology Implications of a Chiplet-Based Future
Samuel Naffziger, Sr. VP, AMD
ABSTRACT
Chiplet architecture is now becoming mainstream, and recognized as fundamental to enabling the continued economically viable growth of power efficient computing. We will cover the benefits of these approaches in enabling lower costs from smaller die combined with modularity to scale performance and configuration, taking examples from industry products. The costs of splitting and modularizing an SOC into chiplets will be discussed, which include the high-bandwidth and low-latency communication requirements between die, overheads of testing and power-managing what used to be individual SOC modules as standalone chips, and engineering the package substrate to provide routing and power delivery resources for the complex integration. Today’s solutions will be evaluated in the context of what will be required from packaging and silicon technologies over the next decade to achieve the true potential of chiplet architecture.
BIOGRAPHY
Samuel Naffziger is AMD senior vice president, Corporate Fellow, and Product Technology Architect. Naffziger works across the company to optimize product technology choices and deployment with a continued focus on driving best practice power/performance/area methodology to maximize product competitiveness, efficiency, and cost. Naffziger has been the lead innovator behind many of AMD’s low-power features and chiplet architecture. He has over 32 years of industry experience with a background in microprocessors and circuit design at Hewlett Packard, Intel and AMD. Naffziger received a Bachelor of Science degree in Electrical Engineering from the California Institute of Technology (CalTech) and a Master of Science from Stanford. Naffziger holds more than 130 U.S. patents in the field and authored dozens of publications and presentations on processors, architecture and power management. He is an IEEE Fellow.
Webex:
https://ieeemeetings.webex.com/ieeemeetings/onstage/g.php?MTID=eb4cf589d34ac145de37ce57882ede6a1
RSVP:
https://events.vtools.ieee.org/event/register/276922
What is My Measurement Equipment Actually Doing? Implications for 5G
May 15, 2021 | Posted by Osman Ceylan under |
On June 30th the AP/MTT and ED/CAS Chapters of the IEEE Foothill Section are hosting the Distinguished Microwave Lecture:
What is My Measurement Equipment Actually Doing? Implications for 5G
Presented by Dr. Jon Martens, Engineering Fellow at Anritsu.
As broadband microwave measurements become more prevalent in the 100+ GHz range, the limitations and challenges related to nonlinearities, dynamic range, calibration, and processing algorithms become topics that uW and mmW engineers must better understand. This presentation shall discuss many of the “under the hood” tasks taking place in microwave instrumentation, giving insights and understanding into measurement sensitivities and potential anomalies.
Please join us for this revealing and informative presentation.
Registration Link: https://events.vtools.ieee.org/m/272059
How to Build an 8-Core Hyper-threaded Computer on a Budget
April 27, 2021 | Posted by Osman Ceylan under |
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Registration is free and required. Starts 30 March 2021 02:40 PM, Ends 12 May 2021 02:00 PM
https://events.vtools.ieee.org/tego_/event/manage/266448
Deep Reinforcement Learning for Power Distribution System Control
April 27, 2021 | Posted by Osman Ceylan under |
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Hello everybody. We would like to announce that our PES Chapter is having a virtual talk on Deep Reinforcement Learning for Power Distribution System Control. That will be on April 28, 2021, from 05:00 to 06:00 PM (PDT) and it will be hosted by Dr. Nanpeng Yu and the speaker is Dr. Yuanqi Gao from the University of California, Riverside.
Zoom Meeting Link: https://ucr.zoom.us/j/94951946768
Meeting ID: 949 5194 6768
Please register on vTools Events. Registration starts from April 21, 2021, to April 28, 2021.
IEEE Foothill Consultants Network FHCN
February 23, 2021 | Posted by Osman Ceylan under |
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Please download and import the following iCalendar (.ics) files to your calendar system.
Join Zoom Meeting
https://us02web.zoom.us/j/81121875392?pwd=VU5BNWZ2dVI0MzlzbWtCMWhQUXYxZz09
Meeting ID: 811 2187 5392
Passcode: 930305
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Meeting ID: 811 2187 5392
Passcode: 930305
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