Posts Tagged by IEEE EDS
IEEE Foothill Section EDS/CASS Celebrates FET-100 in October
| November 1, 2026 | Posted by Richard Fung under EDCAS, General |
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The IEEE Foothill Section EDS/CaSS Joint Chapter successfully hosted a webinar, “IEEE EDS 100 Years of the FET Series | Phototransistor Memory: Materials, Device Physics, and In-Sensor Processing,” on October 13, 2026. As part of the celebration marking the 100th anniversary of the field-effect transistor (FET), the chapter welcomed Professor […]
Oct. 13: IEEE EDS 100 Years of the FET Series | Phototransistor Memory: Materials, Device Physics, and In-Sensor Processing
| October 8, 2026 | Posted by Richard Fung under EDCAS, General |
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What if a sensor could not only see—but also remember and compute? Join IEEE Foothill EDS for our FET100 seminar featuring Prof. Li-Jing Cheng, Oregon State University, exploring Phototransistor Memory: Materials, Device Physics, and In-Sensor Processing. 📅 October 13 (Tuesday) 6:30PM PDT | 💻 Virtual Event | Free registrationRegister now […]
Foothill EDS/CAS Monthly Brief – September 2026
| September 7, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology IEEE Spectrum: Brain-Inspired Light Sensor Could Speed AI Image Processing – A pixel that both senses light and remembers what it sensed might reduce data movementIEEE Spectrum: The Lab Mistake That Might Revolutionize Computing – The result is a simple and efficient neuromorphic device that mimics a brain […]
Foothill EDS/CAS Monthly Brief – August 2026
| August 13, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology IEEE Spectrum: Why Orbital Data Centers Are Harder Than Silicon Valley Thinks – Shedding heat will require ingenious new designs AI and Industry News EE Times: AI Chip Startup Taalas Acquired by AMDEE Times: Sony-TSMC $4.7B Deal Helps Thwart Samsung, Analysts SayEE Times: SK Hynix Nasdaq Debut Shows […]
Foothill EDS/CAS Monthly Brief – July 2026
| July 5, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology IEEE Spectrum: Records Fall for 3D Chip Tech – Hybrid-bonding milestones could make millions more connections between chipsEE Times: IBM Shows Sub-1-nm Chips, Targeting Production in 5 YearsEE Times: Imec Pushes Quantum Toward Manufacturable Silicon Systems AI and Industry News The Register: Uncle Sam bets $500M that Alphabet […]
Foothill EDS/CAS Monthly Brief – June 2026
| June 7, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology & Roadmaps IEEE Spectrum: Junctionless Transistors Show a New Path to 3D Chips IEEE Spectrum: The Next 15 Years of Moore’s Law, According to Imec EE Times: TSMC Defends Transistor Scaling Amid Huawei’s ‘Her’s Law’ Proposal AI & Computing Infrastructure EE Times: Physical AI Pushes Chipmakers Up the […]