Posts Tagged by IEEE Foothill Section
Foothill EDS/CAS Monthly Brief – September 2026
| September 7, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology IEEE Spectrum: Brain-Inspired Light Sensor Could Speed AI Image Processing – A pixel that both senses light and remembers what it sensed might reduce data movementIEEE Spectrum: The Lab Mistake That Might Revolutionize Computing – The result is a simple and efficient neuromorphic device that mimics a brain […]
[Click to View List] List of IEEE PES Foothill Section Webinars
| August 26, 2026 | Posted by Koji Yamashita under PES |
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Date Title Featured DistinguishedSpeaker YouTube Link 10/21/2026 Power System Modeling: What Makes a Model Meaningful? Dr. Pouyan Poubeik N/A 08/26/2026 Samoa’s Power System in Transition: Managing Grid Reliability, Generation Constraints, and the Current Energy Crisis Ms. Sarafina Lesa Coming soon 07/16/2026 Fundamentals of Load Modeling and Power Quality in Modern […]
Foothill EDS/CAS Monthly Brief – August 2026
| August 13, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology IEEE Spectrum: Why Orbital Data Centers Are Harder Than Silicon Valley Thinks – Shedding heat will require ingenious new designs AI and Industry News EE Times: AI Chip Startup Taalas Acquired by AMDEE Times: Sony-TSMC $4.7B Deal Helps Thwart Samsung, Analysts SayEE Times: SK Hynix Nasdaq Debut Shows […]
IEEE PES Webinar: Fundamentals of Load Modelling and Power Quality in Modern Distribution Systems (July 16th, 2026 at 11 AM)
| July 10, 2026 | Posted by Koji Yamashita under PES |
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Abstract Distribution systems are undergoing rapid transformation due to the increasing integration of distributed renewable energy sources, evolving load behaviors, and the growing need for improved power quality. This webinar presents the fundamental principles and practical approaches to load modeling and power quality in modern active distribution networks. The session […]
Foothill EDS/CAS Monthly Brief – July 2026
| July 5, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology IEEE Spectrum: Records Fall for 3D Chip Tech – Hybrid-bonding milestones could make millions more connections between chipsEE Times: IBM Shows Sub-1-nm Chips, Targeting Production in 5 YearsEE Times: Imec Pushes Quantum Toward Manufacturable Silicon Systems AI and Industry News The Register: Uncle Sam bets $500M that Alphabet […]
Foothill EDS/CAS Monthly Brief – June 2026
| June 7, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology & Roadmaps IEEE Spectrum: Junctionless Transistors Show a New Path to 3D Chips IEEE Spectrum: The Next 15 Years of Moore’s Law, According to Imec EE Times: TSMC Defends Transistor Scaling Amid Huawei’s ‘Her’s Law’ Proposal AI & Computing Infrastructure EE Times: Physical AI Pushes Chipmakers Up the […]