Foothill EDS/CAS Monthly Brief – July 2026
| July 5, 2026 | Posted by Richard Fung under EDCAS |
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Semiconductor Technology
IEEE Spectrum: Records Fall for 3D Chip Tech – Hybrid-bonding milestones could make millions more connections between chips
EE Times: IBM Shows Sub-1-nm Chips, Targeting Production in 5 Years
EE Times: Imec Pushes Quantum Toward Manufacturable Silicon Systems
AI and Industry News
The Register: Uncle Sam bets $500M that Alphabet spinoff’s AI can dig up new semiconductor materials
EE Times: AMD Snaps MEXT to Break the Memory Wall
EE Times: Amazon’s Newest Gambit: Selling AI Chips
Upcoming Events
July. 30: Will AI Replace Analog Designers? | SSCS July Technical Webinar, by Behzad Razavi
July. 17: Compact Modeling for Advanced CMOS and Beyond | EDS Webinar, by Arnab Pal
Aug. 23~25: Hot Chips 2026
Editor’s Note
This month’s featured articles highlight several important trends in semiconductor technology. Advances in heterogeneous integration and silicon-based quantum computing continue to expand the limits of system performance and scalability. Meanwhile, the U.S. government is investing in AI-driven materials discovery to strengthen the nation’s manufacturing competitiveness. As AI hardware development costs continue to rise, major technology companies are also exploring new business models by offering custom AI chips to selected customers. Together, these developments reflect the growing convergence of advanced packaging, AI, and next-generation computing.
Prepared by Richard F. for the IEEE Foothill EDS/CAS community.